Simulation in infrared imaging: using electrical circuit principles to model heat transfer

The use of electrical circuits to model the thermal warming and cooling of database objects is discussed with reference to the application of forward looking infrared systems. Previous models yielded object surface temperature predictions which varied much too widely across a diurnal cycle. Thermal capacitance, or heat storage capacity of database objects, was also ignored. Analysis of the original circuit and modifications of this circuit reveals that predicted object surface temperature is highly dependent upon material parameters, including the thickness of the object, its thermal conductivity, and its attachment to other objects. It is noted that, while many of the shortcomings can be overcome, it is clear that in order to produce relative levels of display luminance which are faithful reproductions of the thermal output of individual database objects, more precision is required for parameter estimation. While such precision may be useful for target acquisition models, use of such a complex package for flight training appears unwarranted.<>