基于射频应用的微系统集成技术的发展

Fan Yichen, Huang Yongfang, Cui Kai
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引用次数: 0

摘要

未来电子系统将朝着更高集成度、更高性能和更高工作频率的方向发展。传统的集成封装技术将无法满足新型射频微系统的集成度要求。射频微系统集成技术是实现未来电子系统要求的主要手段。本文综述了射频微系统集成技术的技术内涵和系统。预测了技术挑战和发展机遇。阐述了射频微系统集成技术研究的战略思路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of the Integration Technologies of Microsystems Based on RF Application
In the future, electronic system is developing towards higher integration density, higher performance and higher working frequency. Traditional integration and packaging technology will not reach the integration requirement of the novel RF microsystems. The integration technology of RF microsystems is the main method of realizing the requirement of the future electronic system. In this paper, the technology connotation and system of the RF microsystems integration technology is reviewed. The technology challenge and development opportunity is predicted. The strategic thinking of the research on the integration technology of RF microsystems is illustrated.
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