{"title":"基于射频应用的微系统集成技术的发展","authors":"Fan Yichen, Huang Yongfang, Cui Kai","doi":"10.1109/IWS49314.2020.9359953","DOIUrl":null,"url":null,"abstract":"In the future, electronic system is developing towards higher integration density, higher performance and higher working frequency. Traditional integration and packaging technology will not reach the integration requirement of the novel RF microsystems. The integration technology of RF microsystems is the main method of realizing the requirement of the future electronic system. In this paper, the technology connotation and system of the RF microsystems integration technology is reviewed. The technology challenge and development opportunity is predicted. The strategic thinking of the research on the integration technology of RF microsystems is illustrated.","PeriodicalId":301959,"journal":{"name":"2020 IEEE MTT-S International Wireless Symposium (IWS)","volume":"156 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Development of the Integration Technologies of Microsystems Based on RF Application\",\"authors\":\"Fan Yichen, Huang Yongfang, Cui Kai\",\"doi\":\"10.1109/IWS49314.2020.9359953\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the future, electronic system is developing towards higher integration density, higher performance and higher working frequency. Traditional integration and packaging technology will not reach the integration requirement of the novel RF microsystems. The integration technology of RF microsystems is the main method of realizing the requirement of the future electronic system. In this paper, the technology connotation and system of the RF microsystems integration technology is reviewed. The technology challenge and development opportunity is predicted. The strategic thinking of the research on the integration technology of RF microsystems is illustrated.\",\"PeriodicalId\":301959,\"journal\":{\"name\":\"2020 IEEE MTT-S International Wireless Symposium (IWS)\",\"volume\":\"156 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-09-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE MTT-S International Wireless Symposium (IWS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWS49314.2020.9359953\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE MTT-S International Wireless Symposium (IWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWS49314.2020.9359953","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Development of the Integration Technologies of Microsystems Based on RF Application
In the future, electronic system is developing towards higher integration density, higher performance and higher working frequency. Traditional integration and packaging technology will not reach the integration requirement of the novel RF microsystems. The integration technology of RF microsystems is the main method of realizing the requirement of the future electronic system. In this paper, the technology connotation and system of the RF microsystems integration technology is reviewed. The technology challenge and development opportunity is predicted. The strategic thinking of the research on the integration technology of RF microsystems is illustrated.