LTCC基板上80ghz天线阵列的设计

2011 IEEE GCC Conference and Exhibition (GCC) Pub Date : 2011-04-19 DOI:10.1109/IEEEGCC.2011.5752507

M. El-Nawawy, D. Korzec, W. Mahler

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引用次数: 3

摘要

设计了一种孔径耦合微带贴片天线2×2阵列。该天线设计在低温共烧陶瓷(LTCC)衬底上，并嵌入空腔以提高增益和带宽。模拟的S11在81 GHz和3.5%带宽下为- 21.45 dB，模拟的辐射方向图显示最大增益为10.42 dBi。此外，已经制作了一个原型，并测量了一个缩小到15 GHz的ACMPA。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The design of 80 GHz antenna array on LTCC substrate

A 2×2 array of an aperture coupled microstrip patch antenna (ACMPA) was designed. The antenna was designed on Low Temperature Co-fired Ceramic (LTCC) substrate with an embedded air cavity to increase gain and bandwidth. Simulated S11 was −21.45 dB at 81 GHz with 3.5% bandwidth and the simulated radiation pattern shows a maximum gain of 10.42 dBi. Moreover, a prototype has been fabricated and measured for an ACMPA scaled down to 15 GHz.

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来源期刊

2011 IEEE GCC Conference and Exhibition (GCC)

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