耦合peec -半导体仿真中多扩展点模型降阶的实现

V. Blakaj, Bawar Jalal, Paul L. Evans
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引用次数: 0

摘要

提出了一种生成降阶PEEC模型的算法,该算法解决了由于使用多个扩展点而产生的额外复杂性。使用了L和P PEEC子矩阵的嵌套迭代求解器,并使用多极展开对这些求解器进行了加速。利用商用有限元软件在频域上验证了降阶模型,并与精确的半导体模型进行了时域联合仿真。结果表明,一个耦合的3D PCB安装电感器和半导体联合仿真可以在23分钟内完成100,000个时间步,包括减少阶数模型的生成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Implementation of Multi-Expansion Point Model Order Reduction for Coupled PEEC-Semiconductor Simulations
An algorithm for the generation of reduced order PEEC models is presented, this algorithm addresses the additional complexity resulting from use of multiple expansion points. Nested iterative solvers for the L and P PEEC sub-matrices are used and these solvers are accelerated using multipole expansions. The reduced order models are validated in the frequency domain against commercial finite element software, and time-domain co-simulation with accurate semiconductor models is then demonstrated. It is shown that a coupled, 3D PCB mounted inductor and semiconductor co-simulation with 100,000 time-steps can be completed in 23 minutes including reduced order model generation.
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