{"title":"优化的CMOS红外探测器微系统","authors":"N. Schneeberger, S. Deteindre, O. Paul, H. Baltes","doi":"10.1109/TENCON.1995.496372","DOIUrl":null,"url":null,"abstract":"We fabricated and characterized four different CMOS thermoelectric infrared radiation sensor microsystems. The performance of these systems was modelled with the finite element simulation package SOLIDIS, based on measured materials properties. The agreement with experiment was better than 7.5%. Based on this validation we optimized the design parameters of such microsystems.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Optimized CMOS infrared detector microsystems\",\"authors\":\"N. Schneeberger, S. Deteindre, O. Paul, H. Baltes\",\"doi\":\"10.1109/TENCON.1995.496372\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We fabricated and characterized four different CMOS thermoelectric infrared radiation sensor microsystems. The performance of these systems was modelled with the finite element simulation package SOLIDIS, based on measured materials properties. The agreement with experiment was better than 7.5%. Based on this validation we optimized the design parameters of such microsystems.\",\"PeriodicalId\":425138,\"journal\":{\"name\":\"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-11-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TENCON.1995.496372\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TENCON.1995.496372","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We fabricated and characterized four different CMOS thermoelectric infrared radiation sensor microsystems. The performance of these systems was modelled with the finite element simulation package SOLIDIS, based on measured materials properties. The agreement with experiment was better than 7.5%. Based on this validation we optimized the design parameters of such microsystems.