S. Matsuo, T. Fujii, K. Takeda, H. Nishi, K. Hasebe, T. Kakitsuka
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On-silicon integration of compact and energy-efficient DFB laser with 40-Gbit/s direct modulation
Heterogeneous integration of a DFB laser on SiO2/Si substrate is demonstrated by combining direct bonding and epitaxial regrowth techniques. Energy-efficient direct modulation is achieved by reducing cavity length and increasing optical confinement.