{"title":"导电胶粘剂的电学评价","authors":"K. Schoch, A. Bennett","doi":"10.1109/EIC.1985.7458627","DOIUrl":null,"url":null,"abstract":"The resistivity of several metal-filled adhesives was followed over a frequency range of 1 KHz to 10 MHz. The resistivity of the cured resins increased according to the filler in the order: Ag < Cu < Ni. The resistivity of most of the materials were independent of frequency over the range investigated. The exceptions were the two least conductive materials which decreased in resistivity between 1 MHz and 10 MHz. In addition, the shear strenghts of the adhesives were measured according to ASTM Dl002 on copper surfaces.","PeriodicalId":188957,"journal":{"name":"1985 EIC 17th Electrical/Electronics Insulation Conference","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1985-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Electrical evaluation of conductive adhesives\",\"authors\":\"K. Schoch, A. Bennett\",\"doi\":\"10.1109/EIC.1985.7458627\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The resistivity of several metal-filled adhesives was followed over a frequency range of 1 KHz to 10 MHz. The resistivity of the cured resins increased according to the filler in the order: Ag < Cu < Ni. The resistivity of most of the materials were independent of frequency over the range investigated. The exceptions were the two least conductive materials which decreased in resistivity between 1 MHz and 10 MHz. In addition, the shear strenghts of the adhesives were measured according to ASTM Dl002 on copper surfaces.\",\"PeriodicalId\":188957,\"journal\":{\"name\":\"1985 EIC 17th Electrical/Electronics Insulation Conference\",\"volume\":\"67 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1985-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1985 EIC 17th Electrical/Electronics Insulation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EIC.1985.7458627\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1985 EIC 17th Electrical/Electronics Insulation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EIC.1985.7458627","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
摘要
在1 KHz至10 MHz的频率范围内跟踪几种金属填充胶粘剂的电阻率。固化树脂的电阻率随填料的加入而增大，其顺序为Ag < Cu < Ni。在研究范围内，大多数材料的电阻率与频率无关。例外的是两种导电性最低的材料，其电阻率在1 MHz和10 MHz之间下降。此外，根据ASTM Dl002标准测定了胶粘剂在铜表面的剪切强度。
The resistivity of several metal-filled adhesives was followed over a frequency range of 1 KHz to 10 MHz. The resistivity of the cured resins increased according to the filler in the order: Ag < Cu < Ni. The resistivity of most of the materials were independent of frequency over the range investigated. The exceptions were the two least conductive materials which decreased in resistivity between 1 MHz and 10 MHz. In addition, the shear strenghts of the adhesives were measured according to ASTM Dl002 on copper surfaces.
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