探索芯片多处理器的混合NoC架构

Sirine Mnejja, Y. Aydi, M. Abid
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引用次数: 1

摘要

由于集成在同一多核芯片上的核心数量增加,片上系统(SoC)系统面临的主要挑战是其组件之间的互连。因此,为了解决通信问题成为传统NoC的瓶颈,无线片上网络(WiNoCs)最近被提出用于多处理器片上系统(mp - soc)互连。提出了一种基于网格的混合结构片上网络(NoC),该网络具有双支持和无线通信功能。整个体系结构已经在Noxim平台上实现和集成。对该模型进行了性能评估,分析了网络的动态行为。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Exploring Hybrid NoC Architecture for Chip Multiprocessor
Since the number of cores incorporated on the same multicore chip increases, the main important challenge for System-on-Chip (SoC) systems is the interconnection between their components. Thus, to deal with the problem of communication that became the bottleneck of conventional NoC, wireless Networks on Chip (WiNoCs) have recently been proposed for Multiprocessor systems on chip (MP-SoCs) interconnection. This paper proposed a mesh based Hybrid architecture Network-on-Chip (NoC), which wired dual support and wireless communications. The whole architecture has been implemented and integrated over Noxim platform. A performance evaluation of this model has been illustrated to analyze the dynamic behavior of the Network.
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