用于物联网应用的柔性硅上异构多传感器的cmos兼容大规模单片集成

2016 IEEE International Electron Devices Meeting (IEDM) Pub Date : 2016-12-01 DOI:10.1109/IEDM.2016.7838448

J. M. Nassar, G. T. Sevilla, Seneca J. Velling, M. D. Cordero, M. Hussain

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引用次数: 10

摘要

我们报告了CMOS技术实现了基于柔性体硅(100)的多传感器平台的制造和系统级集成，该平台可以同时感知各种物理变形下的压力，温度，应变和湿度。我们还展示了用于身体生命监测的先进可穿戴版本，它可以为物联网应用提供先进的医疗保健。

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A CMOS-compatible large-scale monolithic integration of heterogeneous multi-sensors on flexible silicon for IoT applications

We report CMOS technology enabled fabrication and system level integration of flexible bulk silicon (100) based multi-sensors platform which can simultaneously sense pressure, temperature, strain and humidity under various physical deformations. We also show an advanced wearable version for body vital monitoring which can enable advanced healthcare for IoT applications.

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2016 IEEE International Electron Devices Meeting (IEDM)

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