D. Titz, R. Pilard, F. Ferrero, F. Gianesello, D. Gloria, C. Luxey, P. Brachat, G. Jacquemod
{"title":"60GHz天线集成高电阻硅技术针对WHDMI应用","authors":"D. Titz, R. Pilard, F. Ferrero, F. Gianesello, D. Gloria, C. Luxey, P. Brachat, G. Jacquemod","doi":"10.1109/RFIC.2011.5940637","DOIUrl":null,"url":null,"abstract":"During past years, various research team have been implied in the development of 60GHz chipset solution, using both BiCMOS or advanced CMOS technologies. But for the 60GHz market to flourish, not only low cost RFICs are required, low cost antennas and packages also are. In order to address these issues, we review in this paper achievable antenna performance using High Resistivity (HR) silicon technologies, by discussing possible integration schemes, antenna design and 3D on wafer characterization. Antenna gain of 3.9 dBi @ 60GHz has been measured making HR Si a promising technbology to address applications packaged in millimeter-wave low cost technology.","PeriodicalId":448165,"journal":{"name":"2011 IEEE Radio Frequency Integrated Circuits Symposium","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"60GHz antenna integrated on High Resistivity silicon technologies targeting WHDMI applications\",\"authors\":\"D. Titz, R. Pilard, F. Ferrero, F. Gianesello, D. Gloria, C. Luxey, P. Brachat, G. Jacquemod\",\"doi\":\"10.1109/RFIC.2011.5940637\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"During past years, various research team have been implied in the development of 60GHz chipset solution, using both BiCMOS or advanced CMOS technologies. But for the 60GHz market to flourish, not only low cost RFICs are required, low cost antennas and packages also are. In order to address these issues, we review in this paper achievable antenna performance using High Resistivity (HR) silicon technologies, by discussing possible integration schemes, antenna design and 3D on wafer characterization. Antenna gain of 3.9 dBi @ 60GHz has been measured making HR Si a promising technbology to address applications packaged in millimeter-wave low cost technology.\",\"PeriodicalId\":448165,\"journal\":{\"name\":\"2011 IEEE Radio Frequency Integrated Circuits Symposium\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-06-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE Radio Frequency Integrated Circuits Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RFIC.2011.5940637\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE Radio Frequency Integrated Circuits Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIC.2011.5940637","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
60GHz antenna integrated on High Resistivity silicon technologies targeting WHDMI applications
During past years, various research team have been implied in the development of 60GHz chipset solution, using both BiCMOS or advanced CMOS technologies. But for the 60GHz market to flourish, not only low cost RFICs are required, low cost antennas and packages also are. In order to address these issues, we review in this paper achievable antenna performance using High Resistivity (HR) silicon technologies, by discussing possible integration schemes, antenna design and 3D on wafer characterization. Antenna gain of 3.9 dBi @ 60GHz has been measured making HR Si a promising technbology to address applications packaged in millimeter-wave low cost technology.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
