{"title":"采用低应力工艺制备的可靠性提高的自对准C/ x波段单片功率HBT放大器","authors":"T. Henderson, T.S. Kim","doi":"10.1109/GAAS.1996.567629","DOIUrl":null,"url":null,"abstract":"We report extensive reliability testing and analysis on GaAs single-finger C/X-band HBTs fabricated for monolithic amplifiers with a low-stress process, The HBTs are self-aligned to maximize RF power performance, with ledge passivation and a low stress epitaxial base and dielectric overcoat to improve reliability. Performed from T/sub jo/=185-340/spl deg/C and J/sub co/=25-50 kA/cm/sup 2/. The temperature and current dependence of the various observed failure modes and mechanisms are described. Long-term (>3000 hour), low temperature (<250/spl deg/C), high current stress tests are found to be accurate indicators of how HBTs degrade under nominal operating conditions. Shorter, high temperature tests may lead to excessively optimistic predictions of activation energy and median time to failure.","PeriodicalId":365997,"journal":{"name":"GaAs IC Symposium IEEE Gallium Arsenide Integrated Circuit Symposium. 18th Annual Technical Digest 1996","volume":"118 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"Improved reliability self-aligned C/X-band monolithic power HBT amplifiers fabricated with a low-stress process\",\"authors\":\"T. Henderson, T.S. Kim\",\"doi\":\"10.1109/GAAS.1996.567629\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report extensive reliability testing and analysis on GaAs single-finger C/X-band HBTs fabricated for monolithic amplifiers with a low-stress process, The HBTs are self-aligned to maximize RF power performance, with ledge passivation and a low stress epitaxial base and dielectric overcoat to improve reliability. Performed from T/sub jo/=185-340/spl deg/C and J/sub co/=25-50 kA/cm/sup 2/. The temperature and current dependence of the various observed failure modes and mechanisms are described. Long-term (>3000 hour), low temperature (<250/spl deg/C), high current stress tests are found to be accurate indicators of how HBTs degrade under nominal operating conditions. Shorter, high temperature tests may lead to excessively optimistic predictions of activation energy and median time to failure.\",\"PeriodicalId\":365997,\"journal\":{\"name\":\"GaAs IC Symposium IEEE Gallium Arsenide Integrated Circuit Symposium. 18th Annual Technical Digest 1996\",\"volume\":\"118 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"GaAs IC Symposium IEEE Gallium Arsenide Integrated Circuit Symposium. 18th Annual Technical Digest 1996\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GAAS.1996.567629\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"GaAs IC Symposium IEEE Gallium Arsenide Integrated Circuit Symposium. 18th Annual Technical Digest 1996","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAAS.1996.567629","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improved reliability self-aligned C/X-band monolithic power HBT amplifiers fabricated with a low-stress process
We report extensive reliability testing and analysis on GaAs single-finger C/X-band HBTs fabricated for monolithic amplifiers with a low-stress process, The HBTs are self-aligned to maximize RF power performance, with ledge passivation and a low stress epitaxial base and dielectric overcoat to improve reliability. Performed from T/sub jo/=185-340/spl deg/C and J/sub co/=25-50 kA/cm/sup 2/. The temperature and current dependence of the various observed failure modes and mechanisms are described. Long-term (>3000 hour), low temperature (<250/spl deg/C), high current stress tests are found to be accurate indicators of how HBTs degrade under nominal operating conditions. Shorter, high temperature tests may lead to excessively optimistic predictions of activation energy and median time to failure.
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