新技术对维修的影响

R. E. Neubauer, W.C. Laird
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引用次数: 1

摘要

作者断言,复杂集成电路将主导下一代电路板、子系统和系统。目视检查和过去用于修理电路板的类似技术不能应用于这些复杂的系统;然而,设计特性(如可测试性设计、内置测试)和制造工艺(如引脚网格阵列、表面安装和插座设备)提供了减少故障隔离、测试和组件更换时间的功能。这些复杂的电路是昂贵的,因此修复包含这些电路的系统需要由工业来解决。作者提出的维修理念是制定远程支持要求,如测试/诊断设备,培训,后勤和维修程序的车队设备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of new technology on repair
The authors assert that complex integrated circuits will dominate the next generation circuit boards, subsystems, and systems. Visual inspection and similar techniques used in repairing circuit boards in the past cannot be applied to these complex systems; however, design features such as design for testability, built-in-test, and manufacturing processes such as pin-grid-array, surface-mounted, and socketed devices provide capabilities that should render fault isolation, testing, and component replacement less time consuming. These complex circuits are expensive, so that repair of the systems containing these circuits needs to be addressed by industry. The authors propose a repair philosophy is to develop long-range support requirements such as test/diagnostic equipments, training, logistics, and repair procedures for fleet equipment.<>
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