用于光视频分配系统的新型射频芯片封装的0.4- 8ghz宽带mmic

2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium Digest of Papers (Cat. No.00CH37096) Pub Date : 2000-06-10 DOI:10.1109/RFIC.2000.854439

K. Fujimoto, K. Kawashima, M. Nishitsuji, K. Nobori, H. Nagata, O. Ishikawa

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引用次数: 2

摘要

为光学视频分配系统开发了新型射频芯片尺寸封装(RF- csp)的0.4- 8ghz宽带mmic。利用各向异性导电膜(ACF)进行倒装键合，使RF-CSP的制作工艺变得非常简单和经济。这个RF-CSP是迄今为止报道的最小的包之一。

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0.4-8 GHz broadband MMICs in novel RF chip size package for optical video distribution system

0.4-8 GHz broadband MMICs in the novel RF chip size package (RF-CSP) have been developed for the optical video distribution system. By using anisotropic conductive film (ACF) for the flip-chip bonding, fabrication process of RF-CSP becomes very simple and cost effective. This RF-CSP is one of the smallest packages ever reported.

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2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium Digest of Papers (Cat. No.00CH37096)

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