用ESD检测电路分析IC芯子的软故障

2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) Pub Date : 2018-05-01 DOI:10.1109/SAPIW.2018.8401668

T. Ostermann

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引用次数: 1

摘要

由于上电IC上的ESD事件，IO pad帧和IC核心可能出现软故障。检测单元可以检测这些故障，并区分有效信号变化和软故障。本文提出了一种相应的开关阈值可调的数字检测单元。由于探测器单元相对较小(150μm × 16.5μm)，因此可以在IC中放置多次并通过扫描链读出。

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Usage of ESD detector circuit for analyzing soft failures in IC cores

Due to ESD events on powered ICs, soft failures can occur in the IO pad frame and in the core of the IC. A detector cell can be used to detect these faults and distinguish between valid signal changes and soft failures. A corresponding digital detector cell with adjusted switching thresholds is presented in this paper. Since the detector cell is correspondingly small (150μm × 16.5μm), it can be placed several times in the IC and read out via a scan chain.

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2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)

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