目前的现状是以层压板为主，模压型MCM技术

Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI:10.1109/IEMT.1993.398158

P.E. Rogren

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摘要

层压板技术已经发展到能够生产多芯片模块(MCM)基板的地步，可以与cofire陶瓷和薄膜竞争。由于材料的特性和工艺的灵活性，层压MCM具有优越的电气性能。层压板可以预期比cofire陶瓷或薄膜更快，并且比陶瓷基mcm的噪音要低得多。在热性能方面，层压基板上可用的几个级别的热增强与陶瓷或金属封装的类似方法保持同步

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The current state of laminate based, molded MCM technology

Laminate technology has progressed to the point where it is capable of producing multichip module (MCM) substrates that can compete favorably with both cofire ceramic and thin film. By virtue of the properties of the materials set and flexibility of the process, laminate based MCM offer superior electrical performance. Laminates can be expected to be faster than either cofire ceramic or thin film and will be significantly less noise than ceramic based MCMs. In terms of thermal performance, several levels of thermal enhancements available on laminate substrates keep pace with similar methods available for ceramic or metal packages.<>

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Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

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