基于XFEM的颗粒型压电复合材料断裂模拟

Yan-Fei Shen, Yunhe Liu
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引用次数: 0

摘要

本文研究了压电粒子对裂纹尖端参数的影响。采用i积分法求解PE/介电材料的裂纹尖端应力强度因子(SIFs)和电位移强度因子(EDIFs)。i积分可以对混合模SIFs和EDIFs进行解耦,而且对于材料界面来说,i积分是域无关的,这极大地方便了PE颗粒复合材料裂纹尖端场强因子的提取,采用具有任意界面的积分域。最后,研究了PE颗粒对裂纹介质板SIFs和EDIFs的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fracture simulations of particulate piezoelectric composites using the XFEM
This paper investigates the influence of a piezoelectric (PE) particle pair on the crack-tip parameters. The I-integral is employed to solve the crack-tip stress intensity factors (SIFs) and electric displacement intensity factors (EDIFs) of a PE/dielectric material. The I-integral can decouple mixed-mode SIFs and EDIFs, and moreover, it is domain-independent for material interfaces, which greatly facilitate the extraction of the crack-tip field intensity factors for PE particulate composites by adopting an integral domain with arbitrary interfaces. Finally, a cracked dielectric plate reinforced by a pair of PE particles is studied to investigate the influences of the particle pair on the SIFs and EDIFs.
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