S. Flachowsky, T. Herrmann, J. Hontschel, R. Illgen, S. Ong, M. Wiatr, T. Baldauf, W. Klix, R. Stenzel
{"title":"定向硅和SiGe晶体管通道的迁移率和应变效应","authors":"S. Flachowsky, T. Herrmann, J. Hontschel, R. Illgen, S. Ong, M. Wiatr, T. Baldauf, W. Klix, R. Stenzel","doi":"10.1109/ULIS.2012.6193343","DOIUrl":null,"url":null,"abstract":"The impact of compressive and tensile stress on CMOS performance is studied for <;100>; and <;110>; oriented silicon and SiGe channels. The <;110>; channel direction is found to be more stress sensitive whereas the <;100>; oriented transistor has a higher initial hole mobility. These results recommend to use the <;110>; channel orientation for high performance application due to the high drive current gain and <;100>; channel orientation for low power applications where no stress elements are included to ease the overall process complexity and to decrease costs.","PeriodicalId":350544,"journal":{"name":"2012 13th International Conference on Ultimate Integration on Silicon (ULIS)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-03-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Mobility and strain effects for <100> and <110> oriented silicon and SiGe transistor channels\",\"authors\":\"S. Flachowsky, T. Herrmann, J. Hontschel, R. Illgen, S. Ong, M. Wiatr, T. Baldauf, W. Klix, R. Stenzel\",\"doi\":\"10.1109/ULIS.2012.6193343\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The impact of compressive and tensile stress on CMOS performance is studied for <;100>; and <;110>; oriented silicon and SiGe channels. The <;110>; channel direction is found to be more stress sensitive whereas the <;100>; oriented transistor has a higher initial hole mobility. These results recommend to use the <;110>; channel orientation for high performance application due to the high drive current gain and <;100>; channel orientation for low power applications where no stress elements are included to ease the overall process complexity and to decrease costs.\",\"PeriodicalId\":350544,\"journal\":{\"name\":\"2012 13th International Conference on Ultimate Integration on Silicon (ULIS)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-03-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 13th International Conference on Ultimate Integration on Silicon (ULIS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ULIS.2012.6193343\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 13th International Conference on Ultimate Integration on Silicon (ULIS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ULIS.2012.6193343","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Mobility and strain effects for <100> and <110> oriented silicon and SiGe transistor channels
The impact of compressive and tensile stress on CMOS performance is studied for <;100>; and <;110>; oriented silicon and SiGe channels. The <;110>; channel direction is found to be more stress sensitive whereas the <;100>; oriented transistor has a higher initial hole mobility. These results recommend to use the <;110>; channel orientation for high performance application due to the high drive current gain and <;100>; channel orientation for low power applications where no stress elements are included to ease the overall process complexity and to decrease costs.