等离子体化学技术制备纳米级Si/SiO2多层结构

A. Gismatulin, G. N. Kamaev, A. Antonenko, S. Arzhannikova, V. Volodin, M. Efremov, Anna S. Gileva
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引用次数: 2

摘要

采用α-Si:H薄膜沉积和等离子体增强氧化的方法获得了Si-SiO2多层纳米结构。因此,在厚度为150 Å的SiO2层之间嵌入了厚度为50 Å的6层α-Si:H结构。实验装置采用大孔径高密度电感耦合射频等离子体(ICP)源。通过对MOS电容器的特性分析,研究了该结构的性能。电测量揭示了通过制备的多层纳米结构与电荷传输有关的重要特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Nanoscale Si/SiO2 multilayer structures produced by plasma-chemical technology
Si-SiO2 multilayer nanoscale structures were obtained using а procedures of α-Si:H thin film depositions and subsequently plasma enhanced oxidation. Thus, a structure containing 6 layers of α-Si:H with thickness of 50 Å, inserted between the layers of SiO2 with thickness 150 Å has been created. The experimental setup with source of wide aperture and high-density inductively coupled RF plasma (ICP) was used. The properties of the structures were investigated through the characteristics of MOS capacitors. Electrical measurements reveal significant peculiarities connected with charge transport through prepared multilayer nanoscale structures.
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