IT环境下的封装:电子产品封装设计中的竞争挑战

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI:10.1109/ISEE.2005.1437000

J. Horbal, M. Schaffer

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引用次数: 0

摘要

通过建模和测试来优化电子产品的包装，概述包装设计的考虑因素，并从环境的角度提供包装挑战的细节。

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Packaging in the IT environment: competing challenges in the design of packaging for electronic products

Provide an overview of packaging design considerations through modeling and testing to optimize packaging for electronic products and to provide details of the packaging challenge from an environmental perspective.

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Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.

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