基于三维仿真的功率mos电流传感器温度漂移研究与改进

R. Germana
{"title":"基于三维仿真的功率mos电流传感器温度漂移研究与改进","authors":"R. Germana","doi":"10.1109/ISPSD.2012.6229109","DOIUrl":null,"url":null,"abstract":"A sensefet monitoring is used for overload, open-load detection and load current analog feedback. The sensefet matching properties to the main power mos represent the main quality factor of the device. Its current should be proportional to the main power one, maintaining the same coefficient over the entire temperature and biasing working range. In this work the effects of the edge cells layout and process are analyzed by the help of 3D device simulations. The causes for the real to theoretical ratio mismatch and the drift behavior versus the temperature are put into evidence. The corrective actions allow to reach 1÷2% of drift in the range -40°C to 150°C. Only technological considerations are here faced, concerning the construction and optimization of the structure.","PeriodicalId":371298,"journal":{"name":"2012 24th International Symposium on Power Semiconductor Devices and ICs","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Power mos current sensefet temperature drift study and improvement by the help of 3D simulations\",\"authors\":\"R. Germana\",\"doi\":\"10.1109/ISPSD.2012.6229109\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A sensefet monitoring is used for overload, open-load detection and load current analog feedback. The sensefet matching properties to the main power mos represent the main quality factor of the device. Its current should be proportional to the main power one, maintaining the same coefficient over the entire temperature and biasing working range. In this work the effects of the edge cells layout and process are analyzed by the help of 3D device simulations. The causes for the real to theoretical ratio mismatch and the drift behavior versus the temperature are put into evidence. The corrective actions allow to reach 1÷2% of drift in the range -40°C to 150°C. Only technological considerations are here faced, concerning the construction and optimization of the structure.\",\"PeriodicalId\":371298,\"journal\":{\"name\":\"2012 24th International Symposium on Power Semiconductor Devices and ICs\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 24th International Symposium on Power Semiconductor Devices and ICs\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2012.6229109\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 24th International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2012.6229109","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

传感器监测用于过载、开载检测和负载电流模拟反馈。感测器对主功率的匹配性能是器件的主要品质因子。它的电流应与主电源成正比,在整个温度和偏置工作范围内保持相同的系数。本文通过三维器件仿真,分析了边缘单元的布局和加工过程的影响。分析了实际比与理论比不匹配的原因和温度对漂移的影响。校正动作允许在-40°C至150°C范围内达到1÷2%漂移。这里只面临技术方面的考虑,涉及结构的构造和优化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Power mos current sensefet temperature drift study and improvement by the help of 3D simulations
A sensefet monitoring is used for overload, open-load detection and load current analog feedback. The sensefet matching properties to the main power mos represent the main quality factor of the device. Its current should be proportional to the main power one, maintaining the same coefficient over the entire temperature and biasing working range. In this work the effects of the edge cells layout and process are analyzed by the help of 3D device simulations. The causes for the real to theoretical ratio mismatch and the drift behavior versus the temperature are put into evidence. The corrective actions allow to reach 1÷2% of drift in the range -40°C to 150°C. Only technological considerations are here faced, concerning the construction and optimization of the structure.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信