采用32nm FDSOI晶体管设计具有更好的温度,电源电压和工艺稳定性的环形振荡器,用于ISM波段应用

Sandeep K. Shelke, V. Nitnaware, Suresh K. Rode
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引用次数: 3

摘要

如今,VLSI技术的发展主要是朝着半导体器件的最小化方向发展,这在很大程度上依赖于CMOS技术的进步。在目前的技术中,单个器件的最小尺寸在通道长度上小于100nm。随着CMOS技术尺寸的不断缩小,传统CMOS技术在晶体管尺寸上存在一定的局限性。因此,晶体管采用不同的替代技术开发,以克服这些限制,如MUGFET, FINFET和FDSOI技术。本文主要研究了在HSpice软件中采用32nm传统CMOS晶体管和32nm FDSOI暂态的环形振荡器的设计。与传统CMOS晶体管相比,使用FDSOI(绝缘体上完全耗尽硅)晶体管设计的环形振荡器具有400%更好的电源电压稳定性,200%更好的工艺(栅极长度)稳定性和近乎理想的性能,温度变化范围为0°C至125°C。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of ring oscillator with better temperature, supply voltage & process stability with 32nm FDSOI transistor for ISM band application
Nowadays, the development of VLSI technology mainly directed towards the minimization of semiconductor devices which is heavily dependent on the advancement in CMOS technology. The minimum dimension of single devices in present day's technology is below 100nm in channel length. As CMOS technology dimension is aggressively being scaled down, there are certain limitations on how small a transistor can be developed with conventional CMOS techniques. Hence the transistors are developed with different alternative techniques to overcome these limitations as MUGFET, FINFET & FDSOI techniques. This paper is focused on design of ring oscillator with 32nm conventional CMOS transistor & with 32nm FDSOI transitory in HSpice software. With ring oscillator designed using FDSOI(Fully depleted silicon on insulator) transistor has 400% better supply voltage stability, 200% better process (Gate length) stability & nearly an ideal performance for temperature variation range from 0°C to 125°C as compare with conventional CMOS transistor.
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