{"title":"利用可见光到短波红外CAOS相机首次演示硅片检测能力","authors":"N. Riza","doi":"10.1364/aio.2022.t1a.4","DOIUrl":null,"url":null,"abstract":"Highlighted is the multi-stack silicon wafer inspection capability of the visible to Short-Wave Infrared (SWIR) high linear dynamic range CAOS camera. SWIR experiments successfully image the location of the copper ring metallization between silicon wafers.","PeriodicalId":130317,"journal":{"name":"Applied Industrial Optics (AIO) 2022","volume":"179 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"First Demonstration of Silicon Wafer Inspection Capability using Visible to Short-Wave Infrared CAOS Camera\",\"authors\":\"N. Riza\",\"doi\":\"10.1364/aio.2022.t1a.4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Highlighted is the multi-stack silicon wafer inspection capability of the visible to Short-Wave Infrared (SWIR) high linear dynamic range CAOS camera. SWIR experiments successfully image the location of the copper ring metallization between silicon wafers.\",\"PeriodicalId\":130317,\"journal\":{\"name\":\"Applied Industrial Optics (AIO) 2022\",\"volume\":\"179 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applied Industrial Optics (AIO) 2022\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1364/aio.2022.t1a.4\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Industrial Optics (AIO) 2022","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/aio.2022.t1a.4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
First Demonstration of Silicon Wafer Inspection Capability using Visible to Short-Wave Infrared CAOS Camera
Highlighted is the multi-stack silicon wafer inspection capability of the visible to Short-Wave Infrared (SWIR) high linear dynamic range CAOS camera. SWIR experiments successfully image the location of the copper ring metallization between silicon wafers.
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