3D memory design based on through silicon vias enabled timing optimization

In three-dimensional (3D) integrated circuit (IC), a large number of dummy through silicon vias (TSV) are required for thermal and thinning concerns. However, limited attention is paid to the fact that these dummy TSVs can be multi-functional and used for timing purposes. In this paper, we propose to use those "timing wasteful" dummy TSVs to replace bit line delay cells. Also, a TSV allocation algorithm is presented to optimize the TSV array layout. Finally, three memory designs are implemented to verify the feasibility and reliability of the proposed technology. It is found that all delay cells in these 3 memories can be replaced by TSV arrays.