亚微米互连中电容和电感耦合的可加性

J. Lorival, D. Deschacht, Y. Quéré, T. Gouguec, F. Huret
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引用次数: 10

摘要

集成电路技术的不断发展使得数字芯片的开关速度不断提高。因此,人们对与信号线相关的电感越来越感兴趣。在高性能数字集成电路中,互连的电感耦合效应是一个新兴的问题。在RLC传输线模型的基础上,提出了一种新的串扰噪声模型,并将其与各种传播方式相关联,以评估电容耦合和电感耦合。通过仿真验证了耦合的可加性
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Additivity of capacitive and inductive coupling in submicronic interconnects
Constant evolution in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. Inductive coupling effects on interconnects is an emerging concern in high performance digital integrated circuits. Based on an RLC transmission line model, associated to each propagation mode, a new crosstalk noise model is proposed to evaluate both the capacitive and the inductive coupling. The additivity of the coupling is shown and validated with several simulations
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