紧凑型微带贴片阵列采用高阻抗表面(HIS)基板改善指向性

2017 IEEE International Conference on Antenna Innovations & Modern Technologies for Ground, Aircraft and Satellite Applications (iAIM) Pub Date : 2017-11-01 DOI:10.1109/IAIM.2017.8402613

Maumita Dutta, Hema Singh, R. Manohar

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引用次数: 1

摘要

最近的航空航天应用需要具有低旁瓣电平(SLL)和最佳波束宽度的高性能、低轮廓天线阵列。本文设计了一种紧凑的平面微带贴片阵列，具有低噪点和高增益。贴片天线的尺寸逐渐变细，以实现低于-35 dB的所需低SLL。文中还给出了具有串联共同馈源的紧凑型贴片阵列的结果。仿真结果与实测结果进行了对比验证。此外，为了提高阵列的性能，基板被替换为基于高阻抗表面(HIS)的混合基板。这有助于在反射损耗和指向性方面实现更好的阵列性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Compact microstrip patch array using High-Impedance Surface (HIS) based substrate towards improved directivity

Recent aerospace applications demand a high performance, low-profile antenna array with a low sidelobe level (SLL) and optimum beamwidth. In this paper, a compact planar microstrip patch array has been designed with low SLL and high gain. The dimensions of the patch antenna are tapered to achieve the desired low SLL lower than -35 dB. The results for compact patch array with series corporate feed are also presented. The simulated results are validated against the measured ones. Further, in order to improve the performance of the array, the substrate is replaced with High Impedance Surface (HIS)-based hybrid substrate. This facilitates achieving better array performance in terms of reflection loss and directivity.

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2017 IEEE International Conference on Antenna Innovations & Modern Technologies for Ground, Aircraft and Satellite Applications (iAIM)

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