{"title":"在玻璃衬底上溅射HfO2栅极堆叠的低温多晶硅tft","authors":"A. Hara, Tatsuya Meguro","doi":"10.1109/AM-FPD.2016.7543659","DOIUrl":null,"url":null,"abstract":"We discussed the performance of continuous-wave laser lateral crystallization (CLC) low-temperature (LT) polycrystalline-silicon (poly-Si) thin-film transistors (TFTs) fabricated at 550 °C with a sputtered metal gate and sputtered HfO<sub>2</sub> gate dielectric on a nonalkaline glass substrate. The obtained field-effect mobility of CLC LT poly-Si TFTs with a HfO<sub>2</sub> gate stack was 180 cm<sup>2</sup>/V s. However, the mobility of the HfO<sub>2</sub> gate stack is lower than that of the PECVD-SiO<sub>2</sub> gate stack. It was concluded that this is caused by scattering at defects and imperfections of both the inter layer (IL) SiO<sub>2</sub> and the IL-SiO<sub>2</sub>/Si interface, but not by remote scattering from the high-k dielectric.","PeriodicalId":422453,"journal":{"name":"2016 23rd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Low-temperature poly-Si TFTs with sputtered HfO2 gate stack on glass substrate\",\"authors\":\"A. Hara, Tatsuya Meguro\",\"doi\":\"10.1109/AM-FPD.2016.7543659\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We discussed the performance of continuous-wave laser lateral crystallization (CLC) low-temperature (LT) polycrystalline-silicon (poly-Si) thin-film transistors (TFTs) fabricated at 550 °C with a sputtered metal gate and sputtered HfO<sub>2</sub> gate dielectric on a nonalkaline glass substrate. The obtained field-effect mobility of CLC LT poly-Si TFTs with a HfO<sub>2</sub> gate stack was 180 cm<sup>2</sup>/V s. However, the mobility of the HfO<sub>2</sub> gate stack is lower than that of the PECVD-SiO<sub>2</sub> gate stack. It was concluded that this is caused by scattering at defects and imperfections of both the inter layer (IL) SiO<sub>2</sub> and the IL-SiO<sub>2</sub>/Si interface, but not by remote scattering from the high-k dielectric.\",\"PeriodicalId\":422453,\"journal\":{\"name\":\"2016 23rd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 23rd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/AM-FPD.2016.7543659\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 23rd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AM-FPD.2016.7543659","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Low-temperature poly-Si TFTs with sputtered HfO2 gate stack on glass substrate
We discussed the performance of continuous-wave laser lateral crystallization (CLC) low-temperature (LT) polycrystalline-silicon (poly-Si) thin-film transistors (TFTs) fabricated at 550 °C with a sputtered metal gate and sputtered HfO2 gate dielectric on a nonalkaline glass substrate. The obtained field-effect mobility of CLC LT poly-Si TFTs with a HfO2 gate stack was 180 cm2/V s. However, the mobility of the HfO2 gate stack is lower than that of the PECVD-SiO2 gate stack. It was concluded that this is caused by scattering at defects and imperfections of both the inter layer (IL) SiO2 and the IL-SiO2/Si interface, but not by remote scattering from the high-k dielectric.