RF/5G测试特别会议

2022 IEEE European Test Symposium (ETS) Pub Date : 2022-05-23 DOI:10.1109/ETS54262.2022.9810461

W. Eisenstadt, M. Roos, Devin Morris, J. González-Jiménez, Christopery Mounet, M. Barragán, G. Léger, F. Cilici, E. Lauga-Larroze, S. Mir, S. Bourdel, M. Margalef-Rovira, I. Alaji, H. Ghanem, G. Ducournau, C. Gaquière

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引用次数: 0

摘要

本文提出了一种新颖的160 GHz综合负载-拉力台架。该系统采用55纳米BiCMOS技术设计，可处理所有测量功能，包括信号产生、整形、幅度和相位测量。当与被测设备集成在一起时，该系统将允许精确表征被测设备(DUT)(即电路和/或设备)。此外，所提出的系统也可以设想为片上系统(SoC)，当报告到射频探头时，可以作为任何集成电路的测试台。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Special Session on RF/5G Test

This paper presents an innovative integrated load-pull bench at 160 GHz. The proposed system, which is designed in a 55-nm BiCMOS technology, is tailored to deal with all of the measurement functions including signal generation, shaping, and magnitude and phase measurement. This system will allow precise characterization of Devices-Under-Test (DUTs) (i.e., circuits and/or devices) when integrated together with the DUT. In addition, the proposed system could also be envisioned as a System-on-Chip (SoC) that, when reported into an RF probe, could serve as a test bench for any integrated circuit.

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来源期刊

2022 IEEE European Test Symposium (ETS)

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