C. J. Wu, S. Hsiao, J. Wang, W. H. Lin, C. W. Chang, T. Shao, C. Tung, Doug C. H. Yu
{"title":"3d - ic超高功率散热解决方案","authors":"C. J. Wu, S. Hsiao, J. Wang, W. H. Lin, C. W. Chang, T. Shao, C. Tung, Doug C. H. Yu","doi":"10.23919/VLSICircuits52068.2021.9492489","DOIUrl":null,"url":null,"abstract":"A direct silicon water cooling solution using fusion bonded silicon lid is proposed. It is successfully demonstrated as an effective cooling solution with total power >2600 W on a single SoC, equivalent to power density of 4.8 W/mm2. Low temperature logic chip to silicon lid fusion bonding, with trench/grid cooling structure cutting into silicon lid enables minimal thermal resistance between active device and cooling water and best cooling efficiency. Direct water cooling on logic chip silicon backside has also been demonstrated with power density better than 7 W/mm2.","PeriodicalId":106356,"journal":{"name":"2021 Symposium on VLSI Circuits","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Ultra High Power Cooling Solution for 3D-ICs\",\"authors\":\"C. J. Wu, S. Hsiao, J. Wang, W. H. Lin, C. W. Chang, T. Shao, C. Tung, Doug C. H. Yu\",\"doi\":\"10.23919/VLSICircuits52068.2021.9492489\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A direct silicon water cooling solution using fusion bonded silicon lid is proposed. It is successfully demonstrated as an effective cooling solution with total power >2600 W on a single SoC, equivalent to power density of 4.8 W/mm2. Low temperature logic chip to silicon lid fusion bonding, with trench/grid cooling structure cutting into silicon lid enables minimal thermal resistance between active device and cooling water and best cooling efficiency. Direct water cooling on logic chip silicon backside has also been demonstrated with power density better than 7 W/mm2.\",\"PeriodicalId\":106356,\"journal\":{\"name\":\"2021 Symposium on VLSI Circuits\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-06-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 Symposium on VLSI Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/VLSICircuits52068.2021.9492489\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 Symposium on VLSI Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/VLSICircuits52068.2021.9492489","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A direct silicon water cooling solution using fusion bonded silicon lid is proposed. It is successfully demonstrated as an effective cooling solution with total power >2600 W on a single SoC, equivalent to power density of 4.8 W/mm2. Low temperature logic chip to silicon lid fusion bonding, with trench/grid cooling structure cutting into silicon lid enables minimal thermal resistance between active device and cooling water and best cooling efficiency. Direct water cooling on logic chip silicon backside has also been demonstrated with power density better than 7 W/mm2.
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