基于严格三维地形模拟的布局可制造性分析

A. Strojwas, Zhengrong Zhu, D. Ciplickas, Xiaolei Li
{"title":"基于严格三维地形模拟的布局可制造性分析","authors":"A. Strojwas, Zhengrong Zhu, D. Ciplickas, Xiaolei Li","doi":"10.1109/ISSM.2001.962963","DOIUrl":null,"url":null,"abstract":"This paper presents the latest development of Metropole-3D, a three-dimensional vector simulator that is designed to rigorously simulate the photolithography process in VLSI manufacturing. The development work includes implementation of an efficient and stable solution of Maxwell's equation, a rigorous model for post-exposure bake (PEB) and a fast marching module which simulates the development of photoresist. The integration of these features into a rigorous overall simulation approach enables Metropole-3D to meet the demands of simulating DUV and even more advanced lithography process. Simulation of Focus-Exposure Matrix (FEM) conditions shows good matching to experiments in both dense and isolated lines. Process variation analysis using Metropole-3D is demonstrated in a study of undercut and other effects as function of defocus, dose, or other parameters. Finally, line end printability analysis is shown, as an example use of Metropole-3D to study manufacturability of advanced optical proximity correction (OPC).","PeriodicalId":356225,"journal":{"name":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Layout manufacturability analysis using rigorous 3-d topography simulation\",\"authors\":\"A. Strojwas, Zhengrong Zhu, D. Ciplickas, Xiaolei Li\",\"doi\":\"10.1109/ISSM.2001.962963\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the latest development of Metropole-3D, a three-dimensional vector simulator that is designed to rigorously simulate the photolithography process in VLSI manufacturing. The development work includes implementation of an efficient and stable solution of Maxwell's equation, a rigorous model for post-exposure bake (PEB) and a fast marching module which simulates the development of photoresist. The integration of these features into a rigorous overall simulation approach enables Metropole-3D to meet the demands of simulating DUV and even more advanced lithography process. Simulation of Focus-Exposure Matrix (FEM) conditions shows good matching to experiments in both dense and isolated lines. Process variation analysis using Metropole-3D is demonstrated in a study of undercut and other effects as function of defocus, dose, or other parameters. Finally, line end printability analysis is shown, as an example use of Metropole-3D to study manufacturability of advanced optical proximity correction (OPC).\",\"PeriodicalId\":356225,\"journal\":{\"name\":\"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)\",\"volume\":\"65 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.2001.962963\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2001.962963","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

摘要

本文介绍了metropolis - 3d的最新发展,这是一个三维矢量模拟器,旨在严格模拟超大规模集成电路制造中的光刻过程。开发工作包括实现麦克斯韦方程的高效稳定解,曝光后烘烤(PEB)的严格模型和模拟光刻胶开发的快速行军模块。将这些功能集成到严格的整体模拟方法中,使metropolis - 3d能够满足模拟DUV甚至更先进的光刻工艺的要求。聚焦-曝光矩阵(FEM)条件的仿真结果与实验结果吻合良好。使用metropolis - 3d进行过程变化分析,演示了作为离焦、剂量或其他参数的函数的削边和其他效应的研究。最后,以metropolis - 3d为例,对先进光学接近校正(OPC)的可制造性进行了分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Layout manufacturability analysis using rigorous 3-d topography simulation
This paper presents the latest development of Metropole-3D, a three-dimensional vector simulator that is designed to rigorously simulate the photolithography process in VLSI manufacturing. The development work includes implementation of an efficient and stable solution of Maxwell's equation, a rigorous model for post-exposure bake (PEB) and a fast marching module which simulates the development of photoresist. The integration of these features into a rigorous overall simulation approach enables Metropole-3D to meet the demands of simulating DUV and even more advanced lithography process. Simulation of Focus-Exposure Matrix (FEM) conditions shows good matching to experiments in both dense and isolated lines. Process variation analysis using Metropole-3D is demonstrated in a study of undercut and other effects as function of defocus, dose, or other parameters. Finally, line end printability analysis is shown, as an example use of Metropole-3D to study manufacturability of advanced optical proximity correction (OPC).
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信