p沟道SOI mosfet的衬底浮动效应

Jong-Sun Lyu, S.-W. Kang, C. Lee
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引用次数: 2

摘要

研究了氧注入形成的SOI衬底上制备的p沟道mosfet的浮衬底效应。在p沟道SOI mosfet的饱和状态下,当电子在漏极附近的冲击电离产生并被电场扫入中性浮动衬底时,会发生扭转效应。这降低了衬底电位,从而通过反偏置效应改变了阈值电压。一般来说,p沟道SOI MOSFET比n沟道的对应物具有更低的冲击电离。然而,随着通道掺杂密度的增加和/或通道长度的缩短,会发生更多的冲击电离。因此,要实现VLSI SOI CMOS电路,必须选择器件参数的最佳条件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Substrate floating effects of p-channel SOI MOSFETs
The floating substrate effects of p-channel MOSFETs fabricated on SOI substrates formed by oxygen implantation are studied. The kink effect occurs in the saturation regime for p-channel SOI MOSFETs when electrons are generated by impact ionization near the drain and swept by the electric field into the neutral floating substrate. This lowers substrate potential and thus changes the threshold voltage through the back-bias effect. Generally, the p-channel SOI MOSFET has lower impact ionization than its n-channel counterpart. However, as the channel doping density increases and/or the channel length becomes shorter, more impact ionization occurs. Therefore, optimal conditions in device parameters must be chosen to realize VLSI SOI CMOS circuits.<>
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