热激发电流法研究锆钛酸铅薄膜晶体缺陷

T. Nishida, M. Echizen, T. Takeda, K. Uchiyama, T. Shiosaki
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引用次数: 0

摘要

由于Pb(Zr, Ti)O3 (PZT)铁电薄膜具有FeRAM和MEMS器件应用的潜力,因此得到了广泛的研究。然而,由于PZT薄膜的退化问题,如疲劳和印迹,高性能器件的实现尚未实现。这种退化是由薄膜中的晶体缺陷引起的,然而,这些缺陷的性质尚未得到充分的阐明。因此,我们试图通过热刺激电流(TSC)测量来研究PZT薄膜中的晶体缺陷。在测量中检测到由缺陷引起的电流峰值,并通过系统评估确定观察到的缺陷的来源。结果表明,TSC峰的活化能范围在0.75 ~ 0.95 eV之间,这些峰与电极与PZT层界面处的PbOx缺陷有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of Crystal Defects in Lead Zirconate Titanate Films by Thermally Stimulated Current Measurement
Pb(Zr, Ti)O3 (PZT) ferroelectric thin films have been extensively investigated because of their potential for FeRAM and MEMS device applications. However, realization of high performance devices has not been achieved due to degradation problems for the PZT films, such as fatigue and imprinting. The degradation is caused by crystal defects in the films, however, properties of the defects have not yet been sufficiently clarified. We have therefore attempted to investigate crystal defects in PZT films by thermally stimulated current (TSC) measurements. Current peaks due to the defects were detected in the measurements, and the origin of the observed defects was identified by systematic evaluation. It was revealed that the activation energy of the TSC peaks ranged from 0.75 eV to 0.95 eV, and the peaks were related to PbOx defects at the interface between the electrodes and the PZT layer.
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