Implementation of compact triple-mode module by embedding an IC in printed-circuit-board

A compact module for wireless triple-mode, Wi-Fi, Bluetooth, and GPS, by using system-on-package (SoP) technology are presented in this paper. A CMOS IC for wireless communication is embedded in printed-circuit-board (PCB) and other components are mounted in PCB In order to implement a slim and compact module. A proposed module is composed of a Wi-Fi IC, a Bluetooth IC, GPS IC, a Front-End-Module (FEM) for Wi-Fi/Bluetooth, and a FEM for GPS. A proposed module uses laser drill vias and lamination process by employing polymer substrates. Polymer substrate is composed of epoxy core and ajimoto-bonding film (ABF) to bond each layer. Three times lamination and via drill/Cu plated are employed. Test method for an embedded IC as DC bias, output voltage, PLL locking, and so on, is introduced and tested. A compact module by using SoP technology are designed and implemented. The sizes of compact module and test board are 12.8 mm × 12.8 mm × 1.3 mm and 54.7 mm × 36.4 mm × 2.54 mm, respectively. GPS signal was obtained at -162 dBm/Hz and Wi-Fi and Bluetooth can be successfully communicated at each mode by testing the implemented module. As a result, a presented module shows the possibility of an embedded active IC, compact size, and good performance.