[防酸牙本质层的电子探针显微分析检查]。

T Fukushima, Y Inoue, M Kawaguchi, T Horibe
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引用次数: 0

摘要

采用卤化甲基丙烯酸酯和电子探针显微分析仪(EPMA)相结合的方法,以2-甲基丙烯酰氧乙基氯马来酸氢酯(CIMEM)为基础单体,以2-甲基丙烯酸乙酯(2 BEM)、2-(4-溴苯基)甲基丙烯酸乙酯(BPy1EM)、2-(4-溴-1-萘基)甲基丙烯酸乙酯(BNEM)和2,4,6-三溴苯氧基甲基丙烯酸乙酯(TriBr-PM)为示踪剂,合成了防酸牙本质层的存在和厚度。用37%磷酸溶液处理牙本质30秒后,带示踪剂和不带示踪剂的牙本质黏结强度无统计学差异。扫描电镜结果显示,在树脂-牙本质界面处,所有黏合剂的黏结层厚度均为3 ~ 4微米,可能为防酸牙本质层。EPMA分析表明,C1Ka和BrLa的cps在同一点增加,耐酸牙本质层厚度约为4微米。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
[Electron-probe microanalysis examination of acid-proof dentin layer].

To predict the presence and thickness of the acid-proof dentin layer by the method of combining the halogenated methacrylate and electron-probe microanalyzer (EPMA), 2-methacryloyloxyethyl hydrogen chloromaleate (CIMEM) used as a base monomer for a bonding agent and 2-bromoethyl methacrylate (2 BEM), 2-(4-bromophenyl)ethyl methacrylate (BPy1EM), 2-(4-bromo-1-naphthyl)ethyl methacrylate (BNEM) and 2,4,6-tribromophenoxy methacrylate (TriBr-PM) used as tracers were synthesized. The bond strength to dentin treated with 37% phosphoric acid solution for 30 sec. was not statistically different for the bonding agents with and without tracers. The SEM micrographs revealed that the layers, which may be acid-proof dentin layers, were 3-4 microns thick at the resin-dentin interface for all bonding agents. According to EPMA analysis, cps of C1Ka and BrLa increase at the same points and the acid-proof dentin layer thickness was about 4 microns.

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