基于0.15μm GaN/SiC技术的30-56.5 GHz阻性单端混频器设计

Nethini T. Weerathunge, S. Chakraborty, S. Mahon, Benny Wu, M. Heimlich
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引用次数: 2

摘要

本文介绍了一种基于WIN半导体最新发布的0.15μm GaN/SiC HEMT工艺实现的30 GHz至56.5 GHz宽带阻性混频器。在最佳输入本端功率为12 dBm时,混合器在中频处的转换损耗为10 dB。低中频和射频中频的隔离度分别大于49 dB和34 dB。混频器的输入1dB压缩点为18dbm。包括焊盘在内的芯片尺寸为1 mm2,电路的有效面积仅为0.29 mm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of 30-56.5 GHz Resistive Single-Ended Mixer in 0.15μm GaN/SiC Technology
A wideband resistive mixer from 30 GHz to 56.5 GHz implemented in WIN Semiconductor's newly released 0.15μm GaN/SiC HEMT process is presented in this paper. The mixer exhibits a conversion loss of 10 dB at the midband for an optimum input LO power of 12 dBm. The LO-IF and RF-IF isolations are higher than 49 dB and 34 dB respectively. Mixer's input 1dB compression point is 18 dBm. The chip size including the pads is 1 mm2, and the circuit's active area is only 0.29 mm2.
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