{"title":"在启用dvfs的处理器上实现3d堆叠高速缓存的性能最大化","authors":"K. Kang, Jongpil Jung, C. Kyung","doi":"10.1109/SOCDC.2010.5682975","DOIUrl":null,"url":null,"abstract":"3D integration increases chip integration density, reduces wire length, wire delay and power consumption on wires. However, increased power density causes increase of temperature, which results in the increase of leakage power consumption and performance degradation. In this paper, we propose a solution to compromise these issues on stacking cache memory on a processor core. Experimental results have shown that the proposed method yields, on the average, 16% performance improvement in terms of instructions per second compared to conventional method. The proposed method also reduces energy consumption by 20% on average, in terms of energy per instruction.","PeriodicalId":380183,"journal":{"name":"2010 International SoC Design Conference","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Performance maximization of 3D-stacked cache memory on DVFS-enabled processor\",\"authors\":\"K. Kang, Jongpil Jung, C. Kyung\",\"doi\":\"10.1109/SOCDC.2010.5682975\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"3D integration increases chip integration density, reduces wire length, wire delay and power consumption on wires. However, increased power density causes increase of temperature, which results in the increase of leakage power consumption and performance degradation. In this paper, we propose a solution to compromise these issues on stacking cache memory on a processor core. Experimental results have shown that the proposed method yields, on the average, 16% performance improvement in terms of instructions per second compared to conventional method. The proposed method also reduces energy consumption by 20% on average, in terms of energy per instruction.\",\"PeriodicalId\":380183,\"journal\":{\"name\":\"2010 International SoC Design Conference\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 International SoC Design Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOCDC.2010.5682975\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 International SoC Design Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOCDC.2010.5682975","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Performance maximization of 3D-stacked cache memory on DVFS-enabled processor
3D integration increases chip integration density, reduces wire length, wire delay and power consumption on wires. However, increased power density causes increase of temperature, which results in the increase of leakage power consumption and performance degradation. In this paper, we propose a solution to compromise these issues on stacking cache memory on a processor core. Experimental results have shown that the proposed method yields, on the average, 16% performance improvement in terms of instructions per second compared to conventional method. The proposed method also reduces energy consumption by 20% on average, in terms of energy per instruction.