具有宽带性能的亚太赫兹片上介质谐振器天线

Abdul Ali, J. Yun, H. Ng, D. Kissinger, F. Giannini, P. Colantonio
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引用次数: 12

摘要

本文设计了一种工作在次太赫兹频率下的宽带片上介质谐振器天线。DRA由倒e型片上驱动器、低介电常数支撑体和介电谐振器(DR)组成。350 GHz的驱动器采用l探针馈电机构的衬底集成波导(SIW)腔背片天线。其设计采用了标准的130纳米SiGe BiCMOS后端工艺。片上驱动器的输入匹配、增益和辐射效率通过在其上放置支持和DR来增强。在全电磁仿真中,DRA实现了65 GHz(18.5%)的-10 dB阻抗带宽,峰值增益约为10 dBi, 350 GHz时辐射效率为75%。该天线非常适合未来300 GHz以上的宽带前端系统。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Sub-THz On-Chip Dielectric Resonator Antenna with Wideband performance
This paper presents the design of a wideband on-chip dielectric resonator antenna (DRA) operating at sub-THz frequencies. The DRA consists of inverted E-shaped on-chip driver, a low-permittivity supporter, and a dielectric resonator (DR). Substrate integrated waveguide (SIW) cavity backed on-chip antenna with L-probe feeding mechanism is adopted for the driver at 350 GHz. A standard 130-nm SiGe BiCMOS back-end process is employed in its design. The input matching, gain, and radiation efficiency of the on-chip driver are enhanced by placing a supporter and a DR on top of it. From full-EM simulations, the DRA achieves the -10 dB impedance bandwidth of 65 GHz (18.5%) with peak gain of about 10 dBi and radiation efficiency of 75% at 350 GHz. The developed antenna is highly suitable for future broadband front-end systems operating above 300 GHz.
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