在复杂基底上沉积微米尺寸特征以进行非均相集成

2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2022-07-10 DOI:10.1109/fleps53764.2022.9781595

A. Wiatrowska, K. Fiączyk, P. Kowalczewski, M. Łysień, Łukasz Witczak, Jolanta Gadzalińska, Ludovic Schneider, Łukasz Kosior, F. Granek

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引用次数: 0

摘要

我们展示了一种新的超精密沉积(UPD)技术，用于柔性基板上先进包装和印刷互连的异质集成。UPD允许在复杂的衬底上无掩膜沉积高度浓缩的浆料。打印分辨率范围为1 ~ 10µm。油墨粘度高达2,500,000 cP，相当于85% wt.的金属含量，印刷结构的电导率高达体积值的45%。这项技术是为下一代印刷和柔性电子设备的快速原型设计和制造而设计的，包括传感器、集成电路、显示器和能量收集系统。

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Depositon of Micrometer-Size Features on Complex Substrates for Heterogeneous Integration

We demonstrate a novel Ultra-Precise Deposition (UPD) technology for heterogeneous integration in advanced packaging and printing interconnections on flexible substrates. UPD allows maskless deposition of highly-concentrated pastes on complex substrates. The printing resolution is in the range from 1 to 10 µm. The ink viscosity is up to 2,500,000 cP, which corresponds to 85% wt. of metal content and the electrical conductivity of printed structures is up to 45% of the bulk value. This technology is designed for rapid prototyping and manufacturing of next-generation printed and flexible electronics devices, including sensors, integrated circuits, displays, and energy harvesting systems.

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2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

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