VARIUS-NTV:一种微架构模型,用于捕获多核在接近阈值电压时对工艺变化增加的灵敏度

Ulya R. Karpuzcu, K. Kolluru, N. Kim, J. Torrellas
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引用次数: 94

摘要

近阈值计算(NTC)是一种很有希望实现节能计算的方法,其中电源电压仅略高于晶体管的阈值电压。不幸的是,与传统的超阈值计算(STC)相比,NTC对过程变化更敏感,这会导致更高的功耗和更低的频率,并且潜在的不可忽略的故障率。为了帮助在体系结构级别上解决NTC的变化,本文提出了NTC过程变化的第一个微体系结构模型。该模型称为VARIUS- ntv,扩展了现有的VARIUS变异模型。其关键方面包括:(i)采用针对NTC的门延迟模型和SRAM单元类型,(ii)对NTC出现的SRAM故障模式进行建模,以及(iii)考虑SRAM模型中泄漏的影响。我们在NTC和STC上评估了一个模拟的11nm, 288核平铺多核。结果表明,NTC芯片内的频率和功率变化较大。例如,片上瓦片频率的最大差值在STC为≈2.3 x,在NTC为≈3.7 x。我们还在实验芯片上验证了我们的模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
VARIUS-NTV: A microarchitectural model to capture the increased sensitivity of manycores to process variations at near-threshold voltages
Near-Threshold Computing (NTC), where the supply voltage is only slightly higher than the threshold voltage of transistors, is a promising approach to attain energy-efficient computing. Unfortunately, compared to the conventional Super-Threshold Computing (STC), NTC is more sensitive to process variations, which results in higher power consumption and lower frequencies than would otherwise be possible, and potentially a non-negligible fault rate. To help address variations at NTC at the architecture level, this paper presents the first microarchitectural model of process variations for NTC. The model, called VARIUS-NTV, extends the existing VARIUS variation model. Its key aspects include: (i) adopting a gate-delay model and an SRAM cell type that are tailored to NTC, (ii) modeling SRAM failure modes emerging at NTC, and (iii) accounting for the impact of leakage in SRAM models. We evaluate a simulated 11nm, 288-core tiled manycore at both NTC and STC. The results show higher frequency and power variations within the NTC chip. For example, the maximum difference in on-chip tile frequency is ≈2.3× at STC and ≈3.7× at NTC. We also validate our model against an experimental chip.
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