绝缘栅极III-N器件和集成电路

G. Simin, V. Adivarahan, H. Fatima, S. Saygı, A. Koudymov, X. He, W. Shuai, S. Rai, J. Yang, M. Asif Khan, A. Tarakji, J. Deng, R. Gaska, M. Shur
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引用次数: 1

摘要

MOSHFET的设计结合了MOS结构的优点,可以抑制栅极泄漏电流,而AlGaN/GaN异质界面可以提供高密度、高迁移率的二维电子气通道。本文介绍了AlGaN/GaN MOSHFET和HFET器件的I-V特性、截止频率、射频输出功率、功率增益和非线性畸变的比较综述。在单片集成电路设计中,moshfet具有显著的优势。它们在高温下保持非常高的输入阻抗,甚至高于300 /压升度/C。结果表明,基于MOSHFET的集成电路非常有希望用于各种高功率高温应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Insulated gate III-N devices and ICs
The MOSHFET design which combines the advantage of the MOS structure, which suppresses the gate leakage current, and an AlGaN/GaN heterointerface that provides high density, high mobility two-dimensional electron gas channel. This article presents a comparative review of the I-V characteristics, cut-off frequencies, RF output powers, power gain, and nonlinear distortions of AlGaN/GaN MOSHFET, and HFET device. The MOSHFETs possess significant advantages for the monolitic IC design. They sustain very high input impedance at elevated temperatures, even above 300 /spl deg/C. The results show that the MOSHFET based ICs are extremely promising for a large variety of high-power high-temperature applications.
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