s波段低成本基板圆形贴片天线性能比较研究

2018 Second International Conference on Advances in Electronics, Computers and Communications (ICAECC) Pub Date : 2018-02-01 DOI:10.1109/ICAECC.2018.8479475

A. Javali, Laxmi Sharma, Richa Tengshe, Sutapa Sarkar

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引用次数: 2

摘要

本文研究了以土壤为基片的圆形微带贴片天线(CMPA)和以RT/Duroid 5880为基片的圆形微带贴片天线(CMPA)在s波段的性能。RT/Duroid 5880由于具有低电损耗、低介电损耗、低吸湿性等特点，被广泛用于微带贴片天线(MPA)的制造。然而，这是昂贵的。本工作试图证明土壤基质可以成为未来替代RT/Duroid 5880的竞争者之一。仿真在计算电磁软件FEKO (suite 7.0)中进行。本文的结论是，经济的土壤基质可以成为替代RT/Duroid 5880的潜在候选者，因为在模拟结果比较时，带宽(差异14.07 MHz)，增益(差异0.18 dBi)和指向性(差异0.41 dBi)等关键参数的变化很小或极小。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A comparitive study on the performance of circular patch antenna using low cost substrate for S-band applications

This paper focusses on comparison of the performance of Circular Microstrip Patch Antenna(CMPA) in S-band between CMPA with soil as substrate and CMPA with RT/Duroid 5880 as substrate. RT/Duroid 5880 is commonly used in the fabrication of Microstrip Patch Antennas (MPA) due to its low electrical loss, low dielectric loss, low moisture absorption etc. However, it is costly. This work tries to prove that soil substrate can be one of the contenders in the future to replace RT/Duroid 5880. The simulation is carried out in Computational Electromagnetic Software FEKO (suite 7.0). The paper concludes by stating that soil substrate being economical can be a potential candidate to replace RT/Duroid 5880 as there is very little to minimal change in key parameters such as bandwidth (a difference of 14.07 MHz), gain (a difference of 0.18 dBi) and directivity (a difference of 0.41 dBi) when the simulation results are compared.

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2018 Second International Conference on Advances in Electronics, Computers and Communications (ICAECC)

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