{"title":"宽禁带功率器件在电源中的应用机遇与展望","authors":"Z. Zhao, Chaofeng Cai, Tao Wang","doi":"10.23919/ISPSD.2017.7988980","DOIUrl":null,"url":null,"abstract":"In this paper, the evolvement of power supply with wide bandgap semiconductor, including SiC and GaN devices, is reviewed. Different circuit features are analyzed with unique device characteristics. By employing GaN HEMTs, the power convertor hardware is compared with conventional design. The detailed architecture of convertor is given to evaluate the trend of the next generation power convertors enabled by wide bandgap devices. Practical design is implemented to prove high elïîciency and high density with simplified circuit and auto-manufactory. Based on the analysis of hardware, some relevant issues are discussed in the following part, regarding the technical challenges for the application of SiC/GaN and further optimization targeting different applications.","PeriodicalId":202561,"journal":{"name":"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)","volume":"365 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Application opportunities and expectations for wide bandgap power devices in power supply\",\"authors\":\"Z. Zhao, Chaofeng Cai, Tao Wang\",\"doi\":\"10.23919/ISPSD.2017.7988980\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the evolvement of power supply with wide bandgap semiconductor, including SiC and GaN devices, is reviewed. Different circuit features are analyzed with unique device characteristics. By employing GaN HEMTs, the power convertor hardware is compared with conventional design. The detailed architecture of convertor is given to evaluate the trend of the next generation power convertors enabled by wide bandgap devices. Practical design is implemented to prove high elïîciency and high density with simplified circuit and auto-manufactory. Based on the analysis of hardware, some relevant issues are discussed in the following part, regarding the technical challenges for the application of SiC/GaN and further optimization targeting different applications.\",\"PeriodicalId\":202561,\"journal\":{\"name\":\"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)\",\"volume\":\"365 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ISPSD.2017.7988980\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ISPSD.2017.7988980","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Application opportunities and expectations for wide bandgap power devices in power supply
In this paper, the evolvement of power supply with wide bandgap semiconductor, including SiC and GaN devices, is reviewed. Different circuit features are analyzed with unique device characteristics. By employing GaN HEMTs, the power convertor hardware is compared with conventional design. The detailed architecture of convertor is given to evaluate the trend of the next generation power convertors enabled by wide bandgap devices. Practical design is implemented to prove high elïîciency and high density with simplified circuit and auto-manufactory. Based on the analysis of hardware, some relevant issues are discussed in the following part, regarding the technical challenges for the application of SiC/GaN and further optimization targeting different applications.