Jianwei Liao, Jiewen Tang, Jun Li, Junhao Luo, Chenqi Xiao, Zhigang Cai, Lei Chen
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引用次数: 0
摘要
3D NAND闪存的创新堆叠架构为提高闪存容量和进一步降低单位价格提供了一个有前途的解决方案。然而,由于硬件的性质,这种紧凑的体系结构会导致各种各样的错误。在高密度快闪记忆体中,电荷随时间的流失而引起的保留错误是导致读取重试的主要原因。本文提出了一个经验数学模型来估计三维NAND闪存的基本程序/擦除(P/E)单元块粒度上的保留错误引起的错误率。具体来说,我们考虑了三维NAND闪存的层间干扰、早期保留损失、P/E周期和数据保留时间等因素,建立了广义模型。然后,我们在四种商用3D NAND闪存产品上对模型进行了验证,实验结果验证了我们提出的估计模型的准确性。最后,我们将该模型应用于现有的3D NAND闪存写调度的I/O优化中,以显示其对更好的I/O性能的贡献。
Modeling Retention Errors on Modern 3D-Flash Products
The innovative stacking architecture of 3D NAND flash offers a promising solution to increase the capacity of flash memory and further cut down the per-unit price. Such compact architectures, however, cause varied kinds of errors because of the hardware nature. Specially, retention errors are primary causes of read retries in high-density flash memory, which are induced by charge leakage over time. This paper proposes an empirical mathematical model to estimate the error rate caused by retention errors on the granularity of block, which is the basic program/erase (P/E) unit in 3D NAND flash memory. Specifically, we build the generalized model by considering the factors of layer-to-layer interference, early retention loss, the P/E cycle and the retention time of data of 3D NAND flash memory. Then, we validate the model on four commercial 3D NAND flash products, and the experimental results verify the accuracy of our proposed estimation model. At last, we apply our model in the existing I/O optimization of write scheduling for 3D NAND flash memory, for showing its contributions to better I/O performance.