利用石英微天平能量耗散和耗散监测定量细胞粘附强度

A. M. Esfahani, J. Rosenbohm, Ruiguo Yang
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引用次数: 1

摘要

我们提出了一个力学模型来描述石英晶体微天平耗散监测(QCM-D)探测细胞粘附过程中的能量耗散过程。该模型将QCM-D圆盘视为谐振子,将圆盘与电池之间的摩擦建模为分子键断裂和界面处的流体滑移。键的形成和破裂事件是由传感器盘和细胞膜之间的相对运动控制的。我们认为这种相互作用是振荡器的主要能量耗散通道,因为动态分子键断裂和在电池/磁盘界面层捕获的液体的粘性阻尼是谐振振荡过程中最大的能量损失。与键断裂相比,应力纤维/细胞质摩擦滑移造成的能量损失微不足道。在高键数条件下,能量耗散将由黏着点处的键断裂事件主导,键数和黏着点大小与能量耗散因子呈线性相关。这些发现可以作为基于QCM-D的细胞粘附测定的分析工具。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Quantification of Cell Adhesion Strength using Energy Dissipation from Quartz Microbalance with Dissipation Monitoring
We propose a mechanical model that describes the energy dissipation process in the probing of cell adhesion using quartz crystal microbalance with dissipation monitoring (QCM-D). The model considers the QCM-D disk as a harmonic oscillator and the friction between the disk and the cell is modeled as molecular bond rupturing and the fluidic slip at the interface. The bond formation and rupture events are governed by relative motion between the sensor disk and the cell membrane. We consider this interaction as the main energy dissipation channel for the oscillator, as the dynamic molecular bond rupture and the viscous damping of the trapped liquid at the cell/disk interfacial layer contribute to the most energy loss during the harmonic oscillation. The energy loss due to the frictional slip of the stress fiber/cytoplasm is insignificant compared with the bond rupture. At high bond number conditions, the energy dissipation will be dominated by the bond rupture events at the focal adhesion, and bond number and the size of focal adhesion are linearly related to the energy dissipation factors. These findings can serve as an analytical tool for QCM-D based cell adhesion assays.
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