用于跨装配层次的可测试性度量的框架

S. Davidson, L. Ungar
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引用次数: 4

摘要

我们无法改进我们无法度量的东西,今天系统测试的一个主要问题是,我们不知道它在检测缺陷、诊断故障和确保现场质量方面有多有效。这种情况与集成电路形成对比,在集成电路中,测试质量指标导致电路板和系统测试的dpm为100 - 1000,平均故障时间为数亿小时。本文提出了一个使用故障采样和各种缺陷模型的系统级覆盖度量的框架。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A framework for testability metrics across hierarchical levels of assembly
We cannot improve what we cannot measure and a major issue with system test today is that we do not know how effective it is in detecting defects, diagnosing failures, and ensuring field quality. This situation is in contrast to that of ICs, where test quality metrics have resulted in DPMs of 100 – 1000 at board and system test and mean time to failures in the hundreds of millions of hours. This paper proposes a framework for system level coverage metrics, using fault sampling and a variety of defect models.
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