用于最终缩放CMOS节点的金属/绝缘体/半导体触点:预计的优势和仍然存在的挑战

2016 16th International Workshop on Junction Technology (IWJT) Pub Date : 2016-05-09 DOI:10.1109/IWJT.2016.7486664

J. Borrel, L. Hutin, H. Grampeix, E. Nolot, Magali Tessaire, G. Rodriguez, Y. Morand, F. Nemouchi, M. Grégoire, E. Dubois, M. Vinet

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引用次数: 1

摘要

在本文中，回顾了金属/绝缘体/半导体触点的一些关键基本方面以及在实施过程中发生的实际问题，以便充分理解这种方法的机会和局限性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Metal/Insulator/Semiconductor contacts for ultimately scaled CMOS nodes: Projected benefits and remaining challenges

In this paper, some key fundamental aspects of Metal / Insulator / Semiconductor contacts as well as practical issues occurring with their implementation are reviewed in order to fully comprehend the opportunities and limitations of this approach.

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2016 16th International Workshop on Junction Technology (IWJT)

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