基于Icepak的储能变换器GaN器件热分析与设计

2022 4th International Conference on Smart Power & Internet Energy Systems (SPIES) Pub Date : 2022-12-09 DOI:10.1109/SPIES55999.2022.10082508

Yanping Zhu, Liuhuan He, Hai-Yan Zhu, Wei Zhao, Xin Li, Xiaofeng Sun

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引用次数: 0

摘要

为了优化印制电路板(Printed circuit board, PCB)上的功率器件的散热能力，通常在PCB上增加热通孔，并在背面增加散热器。采用等面积开孔填充的思想，对通孔布置方式进行优化，推导出PCB热通孔单元的热阻计算公式。采用理论计算公式研究了热孔直径、镀铜厚度、填充材料和孔间距对热阻的影响。使用Icepak对热模型进行模拟，以比较PCB上是否存在热通孔以及是否存在散热器对功率器件温度的影响。最后，通过理论分析与仿真结果的对比，验证了理论分析的正确性。

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Thermal Analysis and Design of GaN Device of Energy Storage Converter Based on Icepak

In order to optimize the heat dissipation capability of power devices attached to Printed circuit board (PCB), thermal vias are usually added to the PCB and heatsink are added on the back side. The idea of equal-area split vias filling is used to optimize the vias arrangement pattern, and the calculation formula of thermal resistance of PCB thermal vias unit is derived. The influence of the diameter of thermal vias, copper plating thickness, filling material and vias spacing on thermal resistance is studied by theoretical calculation formula. The thermal model is simulated using Icepak to compare the effects of the presence or absence of thermal vias on the PCB and the presence or absence of a heatsink on the temperature of the power devices. Finally, the correctness of the theoretical analysis is verified by comparing the theoretical analysis with the simulation results.

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2022 4th International Conference on Smart Power & Internet Energy Systems (SPIES)

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