Ming-Ming Li, Hong-li Peng, Ya-Bin Li, Chen-Chen Chen-Chen, Qingmian Wan
{"title":"一种用于高达130GHz的片对片互连的新型键合线和微带线结构","authors":"Ming-Ming Li, Hong-li Peng, Ya-Bin Li, Chen-Chen Chen-Chen, Qingmian Wan","doi":"10.1109/EDAPS50281.2020.9312889","DOIUrl":null,"url":null,"abstract":"A novel structure of bondwire and microstrip lines for Chip-to-Chip inter-connection up to 130GHz is firstly pre-sented in this paper. Its realization is based on PCB heterogeneous integration process. In order to reduce its high inserted loss which mainly caused of high inductance of the bondwire, the microstrip line of the structure is then optimized. Simulated results show that the minimum insertion loss of 1.0 dB for the structure can be achieved, with the bandwidth more than 35 GHz in bands of 100-135 GHz.","PeriodicalId":137699,"journal":{"name":"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A Novel Structure of Bondwire and Microstrip Lines for Chip-to-Chip Inter-Connection Up to 130GHz\",\"authors\":\"Ming-Ming Li, Hong-li Peng, Ya-Bin Li, Chen-Chen Chen-Chen, Qingmian Wan\",\"doi\":\"10.1109/EDAPS50281.2020.9312889\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel structure of bondwire and microstrip lines for Chip-to-Chip inter-connection up to 130GHz is firstly pre-sented in this paper. Its realization is based on PCB heterogeneous integration process. In order to reduce its high inserted loss which mainly caused of high inductance of the bondwire, the microstrip line of the structure is then optimized. Simulated results show that the minimum insertion loss of 1.0 dB for the structure can be achieved, with the bandwidth more than 35 GHz in bands of 100-135 GHz.\",\"PeriodicalId\":137699,\"journal\":{\"name\":\"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS50281.2020.9312889\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS50281.2020.9312889","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Novel Structure of Bondwire and Microstrip Lines for Chip-to-Chip Inter-Connection Up to 130GHz
A novel structure of bondwire and microstrip lines for Chip-to-Chip inter-connection up to 130GHz is firstly pre-sented in this paper. Its realization is based on PCB heterogeneous integration process. In order to reduce its high inserted loss which mainly caused of high inductance of the bondwire, the microstrip line of the structure is then optimized. Simulated results show that the minimum insertion loss of 1.0 dB for the structure can be achieved, with the bandwidth more than 35 GHz in bands of 100-135 GHz.
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