检测Si MOS电容器的异常行为

R. Pascu, G. Pristavu, M. Kusko, F. Draghici, G. Brezeanu
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摘要

硅金属氧化物半导体电容器的制造是为了评估电学行为。在60 - 500K范围内进行的高频电容电压测量在低(60 - 200k)和高(460 - 500K)温度下都表现出异常行为。C-V曲线上的“反转”点被确定为这些范围,随着温度的升高,它们向正值移动。这种行为是可以解释的,在高温区域,少数载流子的显著增加。为了阐明低温行为,平带电压的变化与相对费米能级位置的位移有关。分析表明,在不同能级上,硅带隙中存在重要的界面态密度,主要分布在导带附近。这些陷阱即使在低温下也可以被激活,并且对MOS结构电容有主要影响,特别是当掺杂载流子浓度下降时,在65K以下发生冻结。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Detecting anomalous behavior in Si MOS capacitors
Si MOS capacitors are fabricated in order to assess electrical behavior. High-frequency capacitance-voltage measurements, performed in the 60 – 500 K range exhibit anomalous behavior both at low (60 – 200 K) and high (460 – 500K) temperatures. “Inversion” points on the C-V curves are identified for these ranges, which move towards positive values as temperature rises. This behavior is explainable, for the high-temperature region, by the significant increase in minority carriers. In order to elucidate low-temperature behavior, the flat-band voltage variation is correlated to the shift in relative Fermi level position. The analysis suggests an important density of interface states in the Si band gap, on different energy levels, mostly near the conduction band. These traps can be activated even at cryogenic temperatures and have a dominant effect on MOS structure capacitance, especially as the dopant carrier concentration drops, with freeze out occurring under 65K.
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