虚拟工厂PCB和厚膜电路制造

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887644

O. Kainz, S. Kardoš, S. Slosarcik, Michal Jurcisin, P. Cabúk

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引用次数: 1

摘要

该贡献描述了虚拟加工方法在电工技术教育中的实际实施，旨在将印刷电路板(PCB)和厚膜电路制造作为虚拟电工技术工厂建筑的一部分。描述了用于特定组件开发的适当工具。在开发过程中使用了网络出版和动画技术领域的现有知识。技术过程的动画和视频资料支持的研究文本是虚拟工厂发展的主业。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Virtual factory for PCB and thick-film circuits fabrication

The contribution describes practical implementation of virtual processing approach in education of electrotechnology, aimed to printed circuit boards (PCB) and thick-film circuits fabrication as a part of the virtual electrotechnology factory building. Appropriate tools are described for particular components development. The current knowledge in the field of web publishing and animation technology was used during development. The study texts supported by animations and video materials of technological procedures are the opus locatum at virtual factory development.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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