考虑金线疲劳行为的LED封装可靠性模型

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2016-04-18 DOI:10.1109/EUROSIME.2016.7463326

P. Altieri-Weimar, W. Yuan, E. S. Annibale, S. Schoemaker, D. Amberger, M. Goken, H. W. Hoppel

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引用次数: 11

摘要

通过拉伸疲劳试验和有限元模拟研究了超细金丝的力学性能和疲劳行为。通过拉伸试验和力控拉伸疲劳试验确定了金丝的硬化行为、屈服准则和屈服面。确定了塑性应变与加载应力幅值的关系，计算了循环应变硬化系数。基于温度循环(TC)下的有限元(FE)应力模拟，利用疲劳数据建立了LED封装中粘合金线的预测裂纹模型。通过计算机断层扫描(CT)分析，重建了用于仿真的LED封装中金线的计算机模型。通过在线监测LED导线在TC测试中的裂纹，对预测裂纹模型进行了校准。最后，利用可靠性模型，研究了LED封装设计和材料对导线寿命的影响。

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Reliability model of LED package regarding the fatigue behavior of gold wires

In this study the mechanical properties and fatigue behavior of ultra-fine gold wires are investigated by experimental tension fatigue tests and finite element (FE) simulation. Hardening behavior, yield criterion and yield surface of gold wire are determined by tensile tests and force controlled tension fatigue tests. The relationship between plastic strain and loading stress amplitude is determined and the cyclic strain hardening coefficient is calculated. The fatigue data are used to develop a predictive crack model for gold wires bonded in LED packages, based on finite element (FE) stress simulation at temperature cycles (TC). The computer model of the gold wire in the LED package used in the simulation is reconstructed from computer tomography (CT) analysis. The predictive crack model is calibrated using on-line monitoring of LED wire cracks during TC tests. Finally, using the reliability model, the impact of LED package design and material on the wire lifetime is investigated.

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来源期刊

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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